Inductive coupling link is promising for intracranial brain implants due to low power attentuation ratio compared with acoustic link.
Mm-sized coil to coil communication based on backscattering in order to enable local communication between implant coil has been investigated. The external coil(L1) generates continous wave to provides power to Imp(Rx) and Imp(Tx). The optimal design methodology has been proposed for triple loop design. The Tmp(Tx) switches between two loads, matching and open load, to generate communication signal.
Capacitive Coupling Link
Capacitive link is a pouplar technology for wireless power transfer using high frequency electrical fields to transfer data and power. Compared with inductive coupling link, capacitive coupling link has lower power consumption and higher voltage ratio with cost of co-design of coil and metal plate. The RC model and brief experiment has been performed. On chip design is under investigating.
Inductive coupling link is promising for intracranial brain implants due to low power attentuation ratio compared with acoustic link.
Capacitive link is a pouplar technology for wireless power transfer using high frequency electrical fields to transfer data and power. Compared with inductive coupling link, capacitive coupling link has lower power consumption and higher voltage ratio with cost of co-design of coil and metal plate. The RC model and brief experiment has been performed. On chip design is under investigating.